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Vortrag aus der Physik nanostrukturierter Materialien

24 Jun 2008 by Main.RupertHampl in Studium

Ort: SEMINARRAUM 164/1 1060 Wien, Getreidemarkt 9, Stiege 7, 4. Stock

Zeit: Freitag, 27. Juni 2008, 15.00 Uhr

Einladung zum Vortrag von Prof. Dr. Brigitte Weiss

„The mechanical response of miniaturized materials and material interconnects in microelectronics“

Abstract: The influence of miniaturization on the thermo-mechanical properties and lifetime of materials and material interconnects in microelectronics is being investigated. The most relevant results on single phase materials (Al, Cu, Au) and solderjoints (Ag-Sn on Cu substrate) are shown and discussed. Due to the fact that microjoints in electronic devices are critical failure sites, a new fast shear fatigue testing technique was introduced as an alternative to the classical thermal cycling test procedures. It is possible to obtain lifetime data from wire bonds used in powerelectronics and optimize the manufacturing process in short time. The advantages and problems are presented. Furthermore, the characterization of microstructure of the interconnects has been started using REM and TEM methods. Modal and vibration analysis is used to study interconnect failures non destructively. The applicability of these methods for miniaturized interconnects (automotive electronics) is being discussed.


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Topic revision: r1 - 24 Jun 2008, rupdPHYSIKFHTUFAT

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